| *1 Test method: TMA |
- |
| CTE:α1,X-axis,IPC-TM-650 2.4.24 |
11-13 ppm/°C |
| CTE:α1,Y-axis,IPC-TM-650 2.4.24 |
11-15 ppm/°C |
| CTE:α1,Z-axis,IPC-TM-650 2.4.24 |
40 ppm/°C |
| CTE:α2,Z-axis,IPC-TM-650 2.4.24 |
180 ppm/°C |
| Dielectric constant(Dk)@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50 |
4.6 |
| Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 |
4.6 |
| Dissipation factor(Df )@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50 |
0.016 |
| Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 |
0.01 |
| Water absorption:IPC-TM-650 2.6.2.1,D-24/23 |
0.14 % |
| Flammability:UL,C-48/23/50 |
94V-0 |
| Flexural modulus,Fill/TD:JIS C 6481 |
22 GPa |
| Flexural modulus,Warp/MD:JIS C 6481 |
24 GPa |
| Glass transition temp.(Tg) :DMA |
170 °C |
| Glass transition temp.(Tg) :DSC |
148 °C |
| Glass transition temp.(Tg) :TMA |
145 °C |
| Peel strength,1oz:IPC-TM-650 2.4.8 |
1.8（10.3） kN/m (lb/inch) |
| The above data are typical values and not guaranteed values. |
- |
| The sample thickness |
0.8mm |
| Thermal conductivity:Laser flash,25˚C |
0.62 W/m·K |
| Thermal decomposition temp.(Td):TGA |
355 °C |
| Time to delam(T288)With Cu:IPC-TM-650 2.4.24.1 |
10 min |
| Time to delam(T288)Without Cu:IPC-TM-650 2.4.24.1 |
>120 min |
| Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 |
1 x 10⁹ MΩ·cm |
| Surface resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 |
1 x 10⁸ MΩ |
| Dielectric constant(Dk)@1MHz:IPC-TM-650 2.5.5.9,C-24/23/50 |
4.9 |
| Dissipation factor(Df )@1MHz:IPC-TM-650 2.5.5.9,C-24/23/50 |
0.01 |
