"MEGTRON" series
Features
- Multi-layer circuit board materials suitable to large capacity and high speed transmission of high frequency signal.
- Low Dk/Df, high heat resistance, high reliability.
Circuit Board Materials - Line-up for network
| Series | Description | Global site information | Product finder |
|---|---|---|---|
|
MEGTRON8 |
Ultra-low transmission loss, highly heat-resistant multi-layer circuit board materials |
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| MEGTRON7 R-5785(N), R-5785(GN), R-5785(GE), R-5785(R) |
Ultra-low transmission loss, highly heat-resistant multi-layer circuit board materials |
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| Halogen-free MEGTRON6 R-5375(N), R-5375(E) |
Halogen-free ultra-low transmission loss multi-layer circuit board materials |
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| MEGTRON6 R-5775(N),R-5775(K),R-5775(G),R-5775(S),R-5775(R) |
Ultra-low transmission loss, highly heat-resistant multi-layer circuit board materials |
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| MEGTRON4S, MEGTRON4 R-5725S, R-5725 |
Low transmission loss, highly heat-resistant multi-layer circuit board materials |
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| MEGTRON M R-5735 |
Low transmission loss, highly heat-resistant multi-layer circuit board materials |
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| Halogen-free MEGTRON2 R-1577, R-1577E |
Halogen-free low transmission loss, highly heat-resistant multi-layer circuit board materials |
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| HIPER V R-1755V |
Highly heat-resistant, low CTE multi-layer circuit board materials (High-Tg type) |
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General properties
| Item | Glass transition temp. (Tg) |
CTE z-axis | T288 (with copper) |
Dielectric constant (Dk) |
Dissipation factor (Df) |
Peel strength | ||
| α1 | α2 | @12-14GHz | 1oz (35μm) | |||||
| Test method | DSC | IPC-TM-650 2.4.24 |
IPC-TM-650 2.4.24.1 |
Balanced-type circular disk resonator method |
IPC-TM-650 2.4.8 |
|||
| Condition | A | A | A | C-24/23/50 | A | |||
| Unit | °C | ppm/°C | min | － | kN/m | |||
| MEGTRON8 | R-5795(U) | 220*¹ | 50 | 270 | >120 | 3.08 [@14GHz] |
0.0012 [@14GHz] |
0.7 (Cu: H-VLP3) |
| R-5795(N) | 220*¹ | 50 | 270 | >120 | 3.13 [@14GHz] |
0.0016 [@14GHz] |
0.7 (Cu: H-VLP3) |
|
| MEGTRON7 | R-5785(N) | 200 | 42 | 280 | >120 | 3.31 [@14GHz] |
0.0023 [@14GHz] |
0.8 (Cu: H-VLP) |
| R-5785(GN) | 200 | 42 | 280 | >120 | 3.31 [@14GHz] |
0.0023 [@14GHz] |
0.8 (Cu: H-VLP2) |
|
| R-5785(GE) | 200 | 42 | 280 | >120 | 3.60 [@13GHz] |
0.0034 [@13GHz] |
0.8 (Cu: H-VLP2) |
|
| R-5785(R) | 200 | 42 | 280 | >120 | 3.31 [@14GHz] |
0.0023 [@14GHz] |
0.8*² (Cu: Buried Resistor) |
|
| Halogen-free MEGTRON6 |
R-5375(N) | 250*¹ | 39 | 200 | >120 | 3.36 [@13GHz] |
0.0029 [@13GHz] |
0.6 (Cu: H-VLP2) |
| R-5375(E) | 250*¹ | 39 | 200 | >120 | 3.66 [@13GHz] |
0.0037 [@13GHz] |
0.6 (Cu: H-VLP2) |
|
| MEGTRON6 | R-5775(N) | 185 | 45 | 260 | >120 | 3.34 [@13GHz] |
0.0037 [@13GHz] |
0.8 (Cu: H-VLP) |
| R-5775(K) R-5775(G) |
185 | 45 | 260 | >120 | 3.62 [@13GHz] |
0.0046 [@13GHz] |
0.8 (Cu: H-VLP) |
|
| R-5775(S) | 185 | 45 | 260 | >120 | 3.34 [@13GHz] |
0.0037 [@13GHz] |
0.8*² (Cu: Buried Resistor) |
|
| R-5775(R) | 185 | 45 | 260 | >120 | 3.62 [@13GHz] |
0.0046 [@13GHz] |
0.8*² (Cu: Buried Resistor) |
|
| MEGTRON4 | R-5725 | 176 | 35 | 265 | 30 | 3.68 [@13GHz] |
0.0074 [@13GHz] |
1.2 (Cu: ST) |
| MEGTRON4S | R-5725S | 200 | 32 | 250 | 50 | 3.8 [@10GHz]*³ |
0.007 [@10GHz]*³ |
1.4 (Cu: ST) |
| MEGTRON M | R-5735 | 195 | 31 | 240 | 35 | 3.75 [@13GHz] |
0.0087 [@13GHz] |
1.3 (Cu: ST) |
| Halogen-free MEGTRON2 |
R-1577 | 170 | 34 | 200 | 25 | 4.0 [@10GHz]*³ |
0.013 [@10GHz]*³ |
1.3 (Cu: ST) |
| Halogen-free MEGTRON2E |
R-1577E | 173 | 35 | 210 | 25 | 4.1 [@10GHz]*³ |
0.013 [@10GHz]*³ |
1.3 (Cu: ST) |
| HIPER V | R-1755V | 173 | 44 | 255 | 20 | 4.3 [@10GHz]*³ |
0.020 [@10GHz]*³ |
1.5 (Cu: ST) |
The sample thickness of MEGTRON8, MEGTRON7, MEGTRON6 and Halogen-free MEGTRON6 is 0.75mm. The sample thickness of other part number is 0.8mm.
*1 Test method: DMA
*2 Buried Resistor Copper Foil 1/2oz (18μm)
*3 [@10GHz] Test method: IPC-TM-650 2.5.5.5
Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)
The above data are typical values and not guaranteed values.
