Electronic materials: semiconductor device materials LEXCM Panasonic Industry

LEXCM GX

.
electronic materials: semiconductor device materials LEXCM from Panasonic Industry

Semiconductor packaging encapsulation materials for advanced package

electronic materials: semiconductor device materials - LEXCM New Brand Logo from Panasonic Industry

Contribute to IC substrates as thinner and smaller and low warpage.

Features and benefits

  • Thinning of IC substrates
  • Smaller
  • Low warpage

Applications

  • Package
  • IC substrate

Our products

R-G545L/E

Ultra-low transmission loss Circuit board materials for IC substrate/Module

R-G535S/E

High modulus Low CTE IC substrate materials

R-1515E

High elasticity Low CTE Ultra-thin IC substrate materials

R-1515V

Low CTE IC substrate materials Designed to Improve Reliability