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Semiconductor device materials

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electronic materials: semiconductor device materials from Panasonic Industry

Overview

Panasonic offers a wide range of Semiconductor Encapsulation Materials, Advanced Substrates for Laminate-Based Packages, a variety of high-quality Electronic Assembly Materials, including Adhesives and Surface Mount Technology (SMT) Reinforcement Materials such as Underfills, Sidefills and Corner Bond Adhesives.

Our product

electronic materials: semiconductor device materials LEXCM from Panasonic Industry
Semiconductor device materials

LEXCM GX Series

Contribute to IC substrates as thinner and smaller and low warpage.