Laser_Marker_Methodes

Semiconductor device materials

.
electronic materials: semiconductor device materials from Panasonic Industry

Overview

Panasonic offers a wide range of Semiconductor Encapsulation Materials, Advanced Substrates for Laminate-Based Packages, a variety of high-quality Electronic Assembly Materials, including Adhesives and Surface Mount Technology (SMT) Reinforcement Materials such as Underfills, Sidefills and Corner Bond Adhesives.

Our product

electronic materials: semiconductor device materials LEXCM from Panasonic Industry
Semiconductor device materials

LEXCM GX Series

Contribute to IC substrates as thinner and smaller and low warpage.

Read more about our materials

Electronic Materials
Product notices

Joint Research on ultra-light EMC shielding material development with JAXA*

Panasonic is developing a new ultra-light EMC shielding material with a weight of only 1/270 of the bulk density of aluminum