High-Thermal Conductive Film R-2400 for Multilayer Circuit Boards
Features & benefits
- High Thermal Conductivity
The industry's first high-thermal conductivity of 2.7 W/m・K as a film product for multilayer circuit boards helps reduce the number of thermal management components.
- Excellent resin flowability
The excellent resin flowability allows for the multilayering of electronic circuit boards, contributing to the miniaturization of equipment.
- Meets temperature of 150°C
Certified to meet the UL-specified rated temperature of 150°C and can be used in high-temperature environments.
e.g. vehicle chargers
e.g. power conditioners, inverters, step-up converters
e.g. power supplies, step-up converters
Comparison of thermal conductivity
Superiority of R-2400
Miniaturization of circuit boards by multilayering (cross-sectional view)
|Insufficient resin flowability makes circuit filling difficult.||Excellent resin flowability achieves superior circuit filling properties.|
|Multilayering of circuit boards is not possible because insulating layers cannot be formed.||Multilayering of circuit boards is possible because insulating layers can be formed satisfactorily.|
Component and copper pattern embedding
|Component-embedded applications||Example of copper pattern embedding|
|It is expected to apply R-2400's excellent resin flowability to component-embedded circuit boards.||Cu thickness: 105µm
Film thickness: 100µm x 2ply
|Product line-up (Thickness)||–||–||μm||100, 150|
|Thermal conductivity||ASTM D5470||A||W/m·K||3.8|
|Glass transition temp.(Tg)||DMA||E-1/105||°C||200|
|Withstand voltage vertical to layer||ASTM D149||C-48/23/50||kV||6.5 (100μm)|
|CLTE||IPC-TM-650 2.4.24||E-2/105||ppm||30 (40-260°C)|
|Tracking resistance||ASTM D3638||C-48/23/50||V||600 (PLC-0)|
|Rated temperature (RTI)||UL||–||°C||150|
The sample thickness is 0.8mm. Withstand voltage vertical to layer data is for a thickness of 0.1mm.
Tracking resistance, rated temperature and flammability are data for a combination of R-2400 0.1mm above and below a 0.38mm core material.
Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
The above data are typical values and not guaranteed values.
|High-Thermal Conductive Film R-2400 Flyer||560KB||19.05.2023||English|