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e.g. vehicle chargers
e.g. inverters
e.g. power conditioners, inverters, step-up converters
e.g. power supplies, step-up converters
Miniaturization of circuit boards by multilayering (cross-sectional view)
Conventional Materials | R-2400 | |
---|---|---|
Insufficient resin flowability makes circuit filling difficult. | Excellent resin flowability achieves superior circuit filling properties. | |
Multilayering of circuit boards is not possible because insulating layers cannot be formed. | Multilayering of circuit boards is possible because insulating layers can be formed satisfactorily. |
Component-embedded applications | Example of copper pattern embedding |
---|---|
It is expected to apply R-2400's excellent resin flowability to component-embedded circuit boards. | Cu thickness: 105µm Film thickness: 100µm x 2ply |
Item | Test method | Condition | Unit | Halogen-free R-2400 |
Product line-up (Thickness) | – | – | μm | 100, 150 |
Thermal conductivity | ASTM D5470 | A | W/m·K | 3.8 |
Laser flash | A | W/m·K | 2.7 | |
Glass transition temp.(Tg) | DMA | E-1/105 | °C | 200 |
Withstand voltage vertical to layer | ASTM D149 | C-48/23/50 | kV | 6.5 (100μm) |
CLTE | IPC-TM-650 2.4.24 | E-2/105 | ppm | 30 (40-260°C) |
Tracking resistance | ASTM D3638 | C-48/23/50 | V | 600 (PLC-0) |
Rated temperature (RTI) | UL | – | °C | 150 |
Flammability | UL | C-48/23/50 | – | 94V-0 |
The sample thickness is 0.8mm. Withstand voltage vertical to layer data is for a thickness of 0.1mm.
Tracking resistance, rated temperature and flammability are data for a combination of R-2400 0.1mm above and below a 0.38mm core material.
Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)
The above data are typical values and not guaranteed values.
Name | File type | Size | Date | Language |
---|---|---|---|---|
High-Thermal Conductive Film R-2400 Flyer | 560KB | 19.05.2023 | English |