High-Thermal Conductive Film R-2400 for Multilayer Circuit Boards

Contributes to the miniaturization of equipment by solving thermal issues in high-output xEVs and industrial equipment

Features & benefits

  • High Thermal Conductivity
    The industry's first high-thermal conductivity of 2.7 W/m・K as a film product for multilayer circuit boards helps reduce the number of thermal management components.
  • Excellent resin flowability 
    The excellent resin flowability allows for the multilayering of electronic circuit boards, contributing to the miniaturization of equipment.
  • Meets temperature of 150°C
    Certified to meet the UL-specified rated temperature of 150°C and can be used in high-temperature environments.



e.g. vehicle chargers

Construction machinery

e.g. inverters


e.g. power conditioners, inverters, step-up converters


e.g. power supplies, step-up converters

Superiority of R-2400

Miniaturization of circuit boards by multilayering (cross-sectional view)

Conventional Materials   R-2400
Insufficient resin flowability makes circuit filling difficult.   Excellent resin flowability achieves superior circuit filling properties.
Multilayering of circuit boards is not possible because insulating layers cannot be formed.   Multilayering of circuit boards is possible because insulating layers can be formed satisfactorily.


Superiority of R-2400 - Miniaturization of circuit boards by multilayering

Component and copper pattern embedding

Component-embedded applications Example of copper pattern embedding
It is expected to apply R-2400's excellent resin flowability to component-embedded circuit boards. Cu thickness: 105µm
Film thickness: 100µm x 2ply


electronic materials thermal conductive film R-2400 - component and copper pattern embedding


Item Test method Condition Unit Halogen-free
Product line-up (Thickness) μm 100, 150
Thermal conductivity ASTM D5470 A W/m·K 3.8
Laser flash A W/m·K 2.7
Glass transition temp.(Tg) DMA E-1/105 °C 200
Withstand voltage vertical to layer ASTM D149 C-48/23/50 kV 6.5 (100μm)
CLTE IPC-TM-650 2.4.24 E-2/105 ppm 30 (40-260°C)
Tracking resistance ASTM D3638 C-48/23/50 V 600 (PLC-0)
Rated temperature (RTI) UL °C 150
Flammability UL C-48/23/50 94V-0

The sample thickness is 0.8mm. Withstand voltage vertical to layer data is for a thickness of 0.1mm.
Tracking resistance, rated temperature and flammability are data for a combination of R-2400 0.1mm above and below a 0.38mm core material.

Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),

The above data are typical values and not guaranteed values.


Name File type Size Date Language
PDF High-Thermal Conductive Film R-2400 Flyer 560KB 19.05.2023 English