High-Thermal Conductive Film R-2400 for Multilayer Circuit Boards

Contributes to the miniaturization of equipment by solving thermal issues in high-output xEVs and industrial equipment

Features & benefits

High Thermal Conductivity
The industry's first high-thermal conductivity of 2.7 W/m・K as a film product for multilayer circuit boards helps reduce the number of thermal management components.
Excellent resin flowability
The excellent resin flowability allows for the multilayering of electronic circuit boards, contributing to the miniaturization of equipment.
Meets temperature of 150°C
Certified to meet the UL-specified rated temperature of 150°C and can be used in high-temperature environments.

Applications

Automotive

e.g. vehicle chargers

Construction machinery

e.g. inverters

Photovoltaic

e.g. power conditioners, inverters, step-up converters

Railroads

e.g. power supplies, step-up converters

Comparison of thermal conductivity

Superiority of R-2400

Miniaturization of circuit boards by multilayering (cross-sectional view)

Conventional Materials		R-2400
Insufficient resin flowability makes circuit filling difficult.		Excellent resin flowability achieves superior circuit filling properties.
Multilayering of circuit boards is not possible because insulating layers cannot be formed.		Multilayering of circuit boards is possible because insulating layers can be formed satisfactorily.

Superiority of R-2400 - Miniaturization of circuit boards by multilayering

Component and copper pattern embedding

Component-embedded applications	Example of copper pattern embedding
It is expected to apply R-2400's excellent resin flowability to component-embedded circuit boards.	Cu thickness: 105µm Film thickness: 100µm x 2ply

Properties

Item	Test method	Condition	Unit	Halogen-free R-2400
Item	Test method	Condition	Unit	Halogen-free R-2400
Product line-up (Thickness)	–	–	μm	100, 150
Thermal conductivity	ASTM D5470	A	W/m·K	3.8
Thermal conductivity	Laser flash	A	W/m·K	2.7
Glass transition temp.(Tg)	DMA	E-1/105	°C	200
Withstand voltage vertical to layer	ASTM D149	C-48/23/50	kV	6.5 (100μm)
CLTE	IPC-TM-650 2.4.24	E-2/105	ppm	30 (40-260°C)
Tracking resistance	ASTM D3638	C-48/23/50	V	600 (PLC-0)
Rated temperature (RTI)	UL	–	°C	150
Flammability	UL	C-48/23/50	–	94V-0

_{The sample thickness is 0.8mm. Withstand voltage vertical to layer data is for a thickness of 0.1mm.

Tracking resistance, rated temperature and flammability are data for a combination of R-2400 0.1mm above and below a 0.38mm core material.}

_{Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.

Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),

Chlorine+Bromine:≤0.15wt%(1500ppm)}

_{The above data are typical values and not guaranteed values.}

Downloads

Name	File type	Size	Date	Language
High-Thermal Conductive Film R-2400 Flyer		560KB	19.05.2023	English