Communication infrastructure

Lightweight equipment, and diverse product solutions for the communication of the future.

The future of communication infrastructure will require high-speed server processing performance, particularly at the edge, as well as small, lightweight, and high-powered equipment. Our product lineup includes solutions compatible with antenna, Massive MIMO, wireless unit equipment, digital core units, and server equipment, catering to the diverse needs of base stations, backhaul, and data centers.

In addition to our extensive product range, we also offer support for environmental adjustment systems and various contract development services. Our ultra-lightweight components and materials are highly heat-dissipating, reliable, and ultra-thin, making significant contributions to the information and telecommunications infrastructure sector.

At Panasonic Industry, we are committed to staying ahead of the curve by embracing the 5G and 6G industry trends. Our solutions are designed to meet the evolving demands of the industry, providing prompt and reliable responses to the changing landscape. One of the major shifts we are witnessing is the introduction of Open-RAN in base stations, enabling operators to collaborate with a wide array of vendors.

The future of communication infrastructure will require high-speed server processing performance, particularly at the edge, as well as small, lightweight, and high-powered equipment. Our product lineup includes solutions compatible with antenna, Massive MIMO, wireless unit equipment, digital core units, and server equipment, catering to the diverse needs of base stations, backhaul, and data centers.

In addition to our extensive product range, we also offer support for environmental adjustment systems and various contract development services. Our ultra-lightweight components and materials are highly heat-dissipating, reliable, and ultra-thin, making significant contributions to the information and telecommunications infrastructure sector.

Join us in shaping the future of communication infrastructure with innovative solutions that set new standards for performance and reliability. Experience the power of Panasonic Industry as we pave the way for the next generation of communication technology.

Base station

Transparent conductive film - FineX (Fine Cross)
Devices

Transparent conductive film - FineX (Fine Cross)

The industry's first*1 “unique roll-to-roll construction method” used in double-sided full wiring metal mesh.
Industrial connectors
Connectors

Industrial connectors

Small and though SMT connectors to downsize your design.
Thermal Interface Material (TIM)
Thermal solutions

Thermal Interface Material (TIM)

Our thermal interface material, based on soft graphite material technology which offers a low thermal resistance on both axis to reduce heat source temperature and prolong the lifetime of your device.
Cooling fans
Thermal solutions

Cooling fans

Keeping quiet over a long lifetime by using a unique hydro-dynamic bearing with non-contact rotation.
Capacitors
Components

Capacitors

Wide range of capacitors available
Resistors
Components

Resistors

High quality resistors in a wide range of resistance values, tolerances, and TCR values in various sizes for a variety of applications.
"MEGTRON" series
Circuit board materials

"MEGTRON" series

Multi-layer circuit board materials suitable to large capacity and high speed transmission of high frequency signal.
XPEDION Series
Circuit board materials

XPEDION Series

Multi-layer circuit board materials that achieve low transmission losses in radio frequency range.
LEXCM DF
Semiconductor Device Materials

LEXCM DF

Liquid Materials for Board level Underfill, Adhesives "LEXCM DF" series.

Backhaul

Thermal Interface Material (TIM)
Thermal solutions

Thermal Interface Material (TIM)

Our thermal interface material, based on soft graphite material technology which offers a low thermal resistance on both axis to reduce heat source temperature and prolong the lifetime of your device.
Pumps
Devices

Pumps

Pump selection and optimization for efficient heat transfer systems
Capacitors
Components

Capacitors

Wide range of capacitors available
Resistors
Components

Resistors

High quality resistors in a wide range of resistance values, tolerances, and TCR values in various sizes for a variety of applications.
Signal relays
Relays

Signal relays

A broad portfolio of devices, including latching types, is available for loads up to 2A.
PhotoMOS® relays
Relays

PhotoMOS® relays

The world's most extensive product portfolio for industrial and automotive applications.
LEXCM CF
Semiconductor Device Materials

LEXCM CF

Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment "LEXCM CF" series.
"MEGTRON" series
Circuit board materials

"MEGTRON" series

Multi-layer circuit board materials suitable to large capacity and high speed transmission of high frequency signal.
Thermal Interface Material (TIM)
Thermal solutions

Thermal Interface Material (TIM)

Our thermal interface material, based on soft graphite material technology which offers a low thermal resistance on both axis to reduce heat source temperature and prolong the lifetime of your device.
Cooling fans
Thermal solutions

Cooling fans

Keeping quiet over a long lifetime by using a unique hydro-dynamic bearing with non-contact rotation.

Data center

Thermal Interface Material (TIM)
Thermal solutions

Thermal Interface Material (TIM)

Our thermal interface material, based on soft graphite material technology which offers a low thermal resistance on both axis to reduce heat source temperature and prolong the lifetime of your device.
PhotoMOS® relays
Relays

PhotoMOS® relays

The world's most extensive product portfolio for industrial and automotive applications.
Pumps
Devices

Pumps

Pump selection and optimization for efficient heat transfer systems
"MEGTRON" series
Circuit board materials

"MEGTRON" series

Multi-layer circuit board materials suitable to large capacity and high speed transmission of high frequency signal.
LEXCM GX
Semiconductor Device Materials

LEXCM GX

Contribute to IC substrates as thinner and smaller and low warpage.
LEXCM DF
Semiconductor Device Materials

LEXCM DF

Liquid Materials for Board level Underfill, Adhesives "LEXCM DF" series.
LEXCM CF
Semiconductor Device Materials

LEXCM CF

Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment "LEXCM CF" series.
Capacitors
Components

Capacitors

Wide range of capacitors available
Resistors
Components

Resistors

High quality resistors in a wide range of resistance values, tolerances, and TCR values in various sizes for a variety of applications.
Power relays
Relays

Power relays

A full range of power relays including: slim 5A relays for industrial automation; latching types for building automation: and 120A PCB devices.
Signal relays
Relays

Signal relays

A broad portfolio of devices, including latching types, is available for loads up to 2A.
Cooling fans
Thermal solutions

Cooling fans

Keeping quiet over a long lifetime by using a unique hydro-dynamic bearing with non-contact rotation.
Motors for HVAC-R
Motors

Motors for HVAC-R

The technology behind an efficient and silent ventilation
Rotary compressors
Devices

Rotary compressors

Advanced, Reliable, and Energy-Efficient Solutions for HVAC and Refrigeration.