Communication infrastructure

Lightweight equipment, and diverse product solutions for the communication of the future.

At Panasonic Industry, we are committed to staying ahead of the curve by embracing the 5G and 6G industry trends. Our solutions are designed to meet the evolving demands of the industry, providing prompt and reliable responses to the changing landscape. One of the major shifts we are witnessing is the introduction of Open-RAN in base stations, enabling operators to collaborate with a wide array of vendors.

The future of communication infrastructure will require high-speed server processing performance, particularly at the edge, as well as small, lightweight, and high-powered equipment. Our product lineup includes solutions compatible with antenna, Massive MIMO, wireless unit equipment, digital core units, and server equipment, catering to the diverse needs of base stations, backhaul, and data centers.

In addition to our extensive product range, we also offer support for environmental adjustment systems and various contract development services. Our ultra-lightweight components and materials are highly heat-dissipating, reliable, and ultra-thin, making significant contributions to the information and telecommunications infrastructure sector.

Join us in shaping the future of communication infrastructure with innovative solutions that set new standards for performance and reliability. Experience the power of Panasonic Industry as we pave the way for the next generation of communication technology.

Base station

Transparent conductive film
Devices

Transparent conductive film

The industry's first*1 “unique roll-to-roll construction method” used in double-sided full wiring metal mesh.
Industrial connectors
Connectors

Industrial connectors

Small and though SMT connectors to downsize your design.
Thermal Interface Material (TIM)
Thermal solutions

Thermal Interface Material (TIM)

Our thermal interface material, based on soft graphite material technology which offers a low thermal resistance on both axis to reduce heat source temperature and prolong the lifetime of your device.
Cooling fans
Thermal solutions

Cooling fans

Keeping quiet over a long lifetime by using a unique hydro-dynamic bearing with non-contact rotation.

Backhaul

Thermal Interface Material (TIM)
Thermal solutions

Thermal Interface Material (TIM)

Our thermal interface material, based on soft graphite material technology which offers a low thermal resistance on both axis to reduce heat source temperature and prolong the lifetime of your device.
Pumps
Devices

Pumps

Pump selection and optimization for efficient heat transfer systems

Data center

Thermal Interface Material (TIM)
Thermal solutions

Thermal Interface Material (TIM)

Our thermal interface material, based on soft graphite material technology which offers a low thermal resistance on both axis to reduce heat source temperature and prolong the lifetime of your device.
PhotoMOS® relays
Relays

PhotoMOS® relays

The world's most extensive product portfolio for industrial and automotive applications.
Pumps
Devices

Pumps

Pump selection and optimization for efficient heat transfer systems

For all categories

Circuit board materials
Electronic materials

Circuit board materials

Panasonic provides high performance products for Printed Circuit Board fabrication with industry recognized brands like MEGTRON, XPEDION, FELIOS and HIPER.
SP-Cap
Polymer Aluminum Capacitors

SP-Cap

SP-Cap is a rectangular chip-shaped aluminum electrolytic capacitor that uses a polymer as its electrolyte.
POSCAP
Polymer Tantalum Capacitors

POSCAP

These devices offer a stable capacitance at high frequencies and high temperatures with low ESR/ESL.
OS-CON
Polymer Aluminum Capacitors

OS-CON

OS-CON is a solid aluminum capacitor with a highly conductive polymer.
Inductors (coils)
Components

Inductors (coils)

Panasonic metal composite monolithic structure realizes highest reliability, robustness and performance.
Fixed chip resistors (SMD)
Resistors

Fixed chip resistors (SMD)

Panasonic chip resistors use a soft termination structure for better solder joint reliability in order to minimize cracks in the solder fillet.
ESD protection devices
Multilayer varistors

ESD protection devices

Wide variety of products available by adopting multilayer construction, achieving wide range of usage, such as automotive and general electronics.