Back-end processing: turning wafers into functional chips

Enhance your production line with precision

From wafer to semiconductor: the back-end process transforms circuits into components ready for applications. Each step demands technologies that handle high-speed operation while maintaining micron-level precision. Discover how our solutions help you along the way.

Technology for semicon excellence

Your back-end equipment faces constant market pressure: smaller components, faster cycle times and flawless results. Our specialized components support semiconductor manufacturers seeking optimal performance.

Probing

Automated machines test each die’s electrical properties. Only functional ones move forward.

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Die bonding

A robotic arm places each die onto a substrate. A crucial step in building the final package.

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Wire bonding

Ultrathin wires connect the die to its package. Electrical signals can now flow freely.

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Marking

A laser engraves codes and logos. Essential for traceability and identification.

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From design to reality

The back-end process turns designs into components powering devices from smartphones to cars. With decades of experience, our solutions ensure speed, precision and reliability – just like they do for the front-end process.

Supporting your semiconductor operations globally

With Panasonic Industry’s global support network, including our expert team based in Best, the Netherlands, you can rely on us for fast, responsive service. Our extensive experience in the semicon industry, combined with the backing of our international parent company, ensures that we’re always here to help you succeed.
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