Back-end processing: turning wafers into functional chips
From wafer to semiconductor: the back-end process transforms circuits into components ready for applications. Each step demands technologies that handle high-speed operation while maintaining micron-level precision. Discover how our solutions help you along the way.
Technology for semicon excellence
Your back-end equipment faces constant market pressure: smaller components, faster cycle times and flawless results. Our specialized components support semiconductor manufacturers seeking optimal performance.
Probing
Automated machines test each die’s electrical properties. Only functional ones move forward.
Grinding
Diamond wheels grind the wafer to the right thickness. Thinner wafers mean smaller, more efficient chips.
Wafer mounting
A machine secures the wafer onto a carrier. Essential for stable handling in later steps.
Dicing
Diamond saws or lasers slice the wafer into separate dies. Precision prevents damage to working chips.
Die bonding
A robotic arm places each die onto a substrate. A crucial step in building the final package.
Wire bonding
Molding
A protective resin encapsulates the die and wires. Shields against moisture, dust, and stress.
Trimming & Forming
Excess leadframe is trimmed away. The leads are bent for proper alignment.
Marking
A laser engraves codes and logos. Essential for traceability and identification.
Test handling
Final tests check each chip’s functionality. Defective ones don’t make the cut.
From design to reality
The back-end process turns designs into components powering devices from smartphones to cars. With decades of experience, our solutions ensure speed, precision and reliability – just like they do for the front-end process.
