PAN B611-1 (nRF54L15)
The PAN B611-1 is a Bluetooth 6.0 Low Energy (LE) module based on the Nordic nRF54L15 single chip controller. It is available with an on-board chip antenna or RF bottom pad for easy design-in and facilitated end-certification. The all-in-one SoC including a superset of the most prominent nRF54 Series features combined with more performance and memory, while minimizing current consumption. In addition, the ultra-low current consumption of the PAN B611-1 makes the module an ideal choice for battery powered devices. The small size hybrid castellated holes & LGA footprint design offers the possibility for optical outgoing inspection, 2-layers designs and fast prototyping with hand soldering, while still offering more GPIOs on the bottom if needed.
The module is intended to be certified for CE RED, FCC, ISED and MIC.
Technical Specification
Item |
Performance characteristics |
| RF category | Bluetooth® 6.0 Low Energy (LE) & 802.15.4 |
| Chip | nRF54L15 |
| Variants | Premium: Integrated 32kHZ Crystal and 4 MB flash Standard: Integrated 32kHZ Crystal Economy: cost-effective option |
| Antenna option | Ceramic Antenna (-1C) RF Bottom Pad (-1B) |
| Certification | CE RED / UKCA / FCC / ISED / MIC |
| Order number | ENW89861A01F (PAN B611-1C Premium) ENW89861B01F (PAN B611-1C Standard) ENW89861C01F (PAN B611-1C Economy) ENW89861AXKF (PAN B611-1C Evaluation Board) ENW89861D01F (PAN B611-1B Premium) ENW89861E01F (PAN B611-1B Standard) ENW89861F01F (PAN B611-1B Economy) ENW89861DXKF (PAN B611-1B Evaluation Board) |
| Production status | Mass Production |
| Software | nRF Connect SDK |
| Size (l x w x h) [mm] | 10.35 x 9.6 x 1.9 |
| Rx sensitivity | -96 dBm @1Mb/s,-104 dBm @125kb/s (-1C) |
| Tx power max | +8 dBm (-1C) |
| Power supply [V] | 1.7 to 3.6 |
| Power consumption Tx | 4.8 mA @0dBm |
| Power consumption Rx | 3.3 mA |
| Power consumption sleep | 0.6 µA (wake on reset) |
| Interfaces | Up to 32× General Purpose I/Os (GPIO) at 1.7 V, to 3.6 V, which are shared by SPI, I²C, UART, PWM, ADC (up to 14-bit), NFC, QSPI |
| Microcontroller | ARM Cortex M33 (128 MHz) |
| Memory | 1.5MB Flash and 256kB RAM |
| Operating temperature | -40 to +85 °C |
| Standard packaging QTY | 500 pcs |
Evaluation Boards
The evaluation board for PAN B611-1 features
- Arduino interface configurable as shield or board
- mikroBUS interface
- All GPIOs accessible via pin headers
- Power measurement interface
- Segger J-Link on-board debugger
- Virtual COM port over Segger J-Link on-board debugger
- Peripherals can be deactivated for low power applications
- 4x user buttons, 4x user LEDs
- FPC connector for NFC antenna (antenna is included)
- Compatible to nRF Connect SDK projects
| P/N | Package includes | Stock Search |
|---|---|---|
| ENW89861AXKF | 1x PAN B611-1C Evaluation Board | BUY |
| ENW89861DXKF | 1x PAN B611-1B Evaluation Board, 1x FPC antenna from TE Connectivity | BUY |
PAN B611-1 EVB documentation
Get all the technical information on the PAN B611-1 Evaluation Board here!
Contents of the Wireless Connectivity Development Hub:
- User Manual for the PAN B611-1 EVB
- Software Development Guide for Toolchain Setup
- Downloadable schematics of the Evaluation Boards (EVBs) as reference design
Click here: PAN B611-1 - Wireless Connectivity Development Hub
Datasheet
| Name | File type | Size | Date | Language |
|---|---|---|---|---|
| PAN B611-1 Product Flyer | Flyer | 614 KB | 12.08.2025 | English |
