Probing: the critical first test for semiconductor reliability
Wafer probing tests each die – the unpackaged circuit that will become a chip – before packaging. With rising production costs, detecting defects as early as possible is essential. Our precision components support your systems for consistently reliable results.
For wafer- and die-level testing
Probing machines connect highly integrated chips to electrical testing equipment. Ensure perfect positioning with our sensors for precise wafer detection and accurate alignment. Get perfect contact with miniaturized test pads to identify and reject failed dies, saving significant downstream costs.
Solutions for evolving test requirements
Shrinking pad sizes, higher pin counts, and faster test speeds require constant innovation. Advanced devices demand lower contact force to prevent damage while maintaining electrical connections. Get ready for tomorrow's testing challenges with the finest precision technology. Delivered by solutions that extend from wafer probing to every step of your back-end process.
