Wire bonding: creating critical electrical connections
Wire bonding connects semiconductor dies to package leads using ultrathin wires. This process creates the electrical pathways essential for chip functionality. With our precision components, you support consistent wire placement and reliable connections.
Sensor control in bonding systems
Wire bonding equipment demands exact positioning for die and lead frame alignment. That’s challenging – but also achievable. Our sensors deliver accurate capillary positioning, wire feed monitoring and bond quality verification. They also support dispenser height control and stroke movement monitoring. While you apply force control, you also ensure stable bonds and consistent placement.
Meeting modern connection demands
Modern packages demand fine-pitch connections, varied wire heights and bond pad materials such as gold, aluminum and copper. Also, they require consistent loop geometry across die sizes and package types. Our components meet these evolving needs with full accuracy and control. From fine-pitch to power applications, we support every wire bonding challenge. Explore our components for your precision.
