Electronic Materials

In a joint project of "JAXA Space Exploration Innovation Hub Center", Panasonic Industry Co., Ltd. and Nagoya University, Tokai National Higher Education and Research System, National University Corporation (hereinafter referred to as Nagoya University), Yamagata University, National University Corporation, Akita University, National University Corporation and JAXA are developing an ultra-light EMC shielding material technology.

Lightness and excellent electromagnetic shielding and absorption are at the core of this new technology. In order to contribute to a weight reduction of, for example, spacecraft, avionic applications, industrial equipment, or in-vehicle devices. The new technology also increases the communication quality of 5G/6G devices when implemented into base stations.

Weight

Using a carbon nanotube technology, that was developed by Nagoya University, and combining it with Panasonic Industry’s thermosetting polymer formulation, a new material could be developed that shows an EMC shielding performance similar to aluminum. But the weight of the newly developed material is only 1/270 of aluminum, roughly 0.01g/cm3 of bulk density.

Shielding material Bulk density
Aluminum 2.7 g/cm³
New ultra-light shiedling materials 0.01 g/cm³ level
*roughly equivalent to expanded polystyrene (approx. 0.01 to 0.03 g/cm³

Composition

Thanks to Panasonic Industry’s thermosetting resin formulation technology and the manufacturing method of freeze-drying, the ultra-light shielding material can be shaped in three-dimensional structures. This excellent workability allows the material to follow a customized shape for each individual device.

By altering the composition of the new material, it is feasible to set the electromagnetic wave frequency band to be shielded in accordance with the requirements of end-use devices. The novel material provides effective electromagnetic shielding across a wide range of electromagnetic settings, reducing the likelihood of noise-related device faults and simplifying EMC design.

Unlike aluminum, the new materials have specific electromagnetic absorption capabilities that can prevent the reflected noise generated by devices themselves, including CPUs, and reduce deterioration of device characteristics deterioration due to noise superposition. The new material also works over a variety of frequency bands, which promotes the spread of next-generation wireless communication technologies.

Advantages

Especially in weight-sensitive applications such as satellites, space probes, electric aircraft applications like eVTOLs (electric Vertical Take-Off and Landing aircraft), drones, robots, or AGVs, the lighter shielding material ultimately helps improve the range or reduce the power consumption. Secondly, when thinking of communication, the ultra-light EMC shielding material enhances the signal quality of 5G/6G base stations through the effective reduction of electromagnetic interference.

In cooperation with JAXA, current tests include conducting studies for commercializing ultra-lightweight electromagnetic shielding and absorbing materials until June 2024. Panasonic Industry aims to commercialize the ultra-light EMC shielding material technology in 2024.

Electronic Materials

Electronic materials from Europe

Panasonic Industry has a rich history in developing and producing electronic materials. High-tech materials for the production of circuit boards, semiconductor devices, plastic molding compounds, and advanced films are part of the portfolio. These are based on our three core technologies, resin design, processing, and evaluation and analysis, which increase the functionality and reliability of electronic devices and semiconductor. Manufacturers for products like ICT infrastructure equipment, IC packaging, automotive or industrial equipment components, or wearables rely on electronic materials from Panasonic Industry.

In ten factories around the world, Panasonic Industry produces specialized electronic materials. As one of these factories, various high-tech materials for multi-layer circuit boards are being produced in Enns, Austria. This production site was established in 1985 and acquired by Panasonic in the year 2000, and the material production was constantly updated. Right now, high-tech laminates and substrates, the basis for producing printed circuit boards, are made in Enns. In addition, we have set up “Research and Marketing(R&M)” to contribute European customers.

*JAXA
JAXA is an abbreviation for Japan Aerospace Exploration Agency. A national research and development agency that consistently conducts everything from basic research in the aerospace field to development and utilization. https://global.jaxa.jp/about/jaxa/index.html