PAN B511-1x - Coming soon

The PAN B511-1x is Panasonic's next gen Bluetooth 5.4 Module with a hybrid Castellated holes & LGA footprint design intended for cost-effective, high performance Bluetooth Low Energy applications.

Product information

The PAN B511-1x is a Bluetooth 5.4 Low Energy (LE) module based on the Nordic nRF54L15 single chip controller.

It is available with an on-board chip antenna and with a RF-bottom pad. The all-in-one SoC including a superset of the most prominent nRF54 Series features combined with more performance and memory, while minimizing current consumption. In addition, the ultra-low current consumption of the PAN B511-1C makes the module an ideal choice for battery powered devices.The small size hybrid castellated holes & LGA footprint design offers the possibility for optical outgoing inspection, 2-layers designs and fast prototyping with hand soldering, while still offering more GPIOs on the bottom if needed.

The solution is intended to be certified for CE RED, FCC, ISED and MIC.

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Performance characteristics

RF category Bluetooth® 5.4 Low Energy (LE)
Frequency [GHz] 2.4
Integrated IC nRF54L15
Software nRF Connect SDK
Antenna option Integrated chip (PAN B511-1C) or bottom pad (PAN B511-1B)
Ext. certified antenna types (Flex)PCB / Terminal*
Planned Certification CE RED, FCC, ISED, MIC*
Operating temperature [°C] -40 to +85*
GPIOs 32
Size [mm] 10.35 x 9.6 (PAN B511-1B)
10.35 x 9.6 (PAN B511-1C)
Production status In Development

*tbc

Timeline

EVB  Q4 / 2024 - Available on request. Please reach out to Panasonic Sales
Mass Production H1 / 2025

Downloads

Name File type Size Date Language
PDF PAN B511-1C - Bluetooth 6 & 802.15.4 Module Flyer 434 KB 11.12.2024 English

Request early samples & evaluation tools today!