R-1755V
HIPER V
Highly heat resistant Low CTE Multi-layer circuit board materials <High-Tg type>
Product specifications for this product
| Item | Product specifications |
|---|---|
| *1 Test method: TMA | - |
| CTE:α1,X-axis,IPC-TM-650 2.4.24 | 11-13 ppm/°C |
| CTE:α1,Y-axis,IPC-TM-650 2.4.24 | 13-15 ppm/°C |
| CTE:α1,Z-axis,IPC-TM-650 2.4.24 | 44 ppm/°C |
| CTE:α2,Z-axis,IPC-TM-650 2.4.24 | 255 ppm/°C |
| Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 | 4.44 |
| Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 | 0.016 |
| Water absorption:IPC-TM-650 2.6.2.1,D-24/23 | 0.12 % |
| Flammability:UL,C-48/23/50 | 94V-0 |
| Flexural modulus,Fill/TD:JIS C 6481 | - |
| Flexural modulus,Warp/MD:JIS C 6481 | - |
| Glass transition temp.(Tg) :DMA | 190 °C |
| Glass transition temp.(Tg) :DSC | 173 °C |
| Glass transition temp.(Tg) :TMA | 165 °C |
| Peel strength,1oz:IPC-TM-650 2.4.8 | 1.5 kN/m (lb/inch) |
| The above data are typical values and not guaranteed values. | - |
| The sample thickness | 32mil=0.8mm |
| Thermal conductivity:Laser flash,25˚C | - |
| Thermal decomposition temp.(Td):TGA | 350 °C |
| Time to delam(T288)With Cu:IPC-TM-650 2.4.24.1 | 20 min |
| Time to delam(T288)Without Cu:IPC-TM-650 2.4.24.1 | >120 min |
| Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 | 1 x 10⁹ MΩ·cm |
| Surface resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 | 1 x 10⁸ MΩ |
| Dielectric constant(Dk)@1MHz:IPC-TM-650 2.5.5.9,C-24/23/50 | 4.7 |
| Dissipation factor(Df )@1MHz:IPC-TM-650 2.5.5.9,C-24/23/50 | 0.013 |
Downloads
Other
| Name | Size | Date | Language |
|---|---|---|---|
| 176.7 KB | 29.08.2025 | English | |
| CDS_HIPER-V_R-1755V_R-1650V_22070136.pdf | 255.2 KB | 03.12.2025 | English |
