PAN13x6C|2 (CC2564C)

ENW89823A5KF & ENW89823C4KF

Panasonic’s PAN13x6C|2 Series is a Host Controlled Interface (HCI) Bluetooth® Radio Frequency (RF) module that brings the CC2564C, Texas Instruments™ seventh generation Bluetooth core integrated circuit, to an easy to use module format. The PAN13x6C|2 is Bluetooth® 5.1 compliant and offers the best-in-class RF performance with about twice the range of other Bluetooth Low Energy solutions. The series comes in two versions: one with an integrated chip antenna (ENW89823A5KF) to keep the RF design effort to a minimum and one with an RF bottom pad (ENW89823C4KF) if radio hostile circumstances require an external antenna. 

Technical Specification


Performance characteristics

Order number

ENW89823A5KF (with Chip Antenna)

ENW89823C4KF (RF Bottom Pad)

Production status Massproduction
RF category Bluetooth® 5.1 dual mode (BR, EDR, Bluetooth® LE)
Software/profile HCI, Init Script by TI, Bluetooth Stack by TI
Used IC CC2564C
Rx sensitivity -90 dBm@1Mb/s
Tx power max

+8 dBm (Chip Antenna)

+11.5 dBm (RF Bottom Pad)

Antenna option Ceramic Chip Antenna, External Antenna over RF Bottom Pad
Size (l x w x h) [mm]

9.0 x 9.5 x 1.8 (ENW89823A5KF)

9.0 x 6.5 x 1.8 (ENW89823C4KF)

Power supply [V] 1.7 to 4.8
Power consumption Tx 40 mA @8dBm (3.3V)
Power consumption Rx 20 mA (3.3V)
Power consumption sleep Deep Sleep Mode: 105 μA
Interfaces GPIO, UART, PCM
Speciality Small size, Bluetooth dual mode
Evaluation board/stick ENW89819AYKF
Certification EU CE RED / FCC / IC 
Operating temperature -40 to +85 °C
Standard packaging QTY 1500 pcs


Start prototyping by purchasing the Evaluation Kit!

It is possible to order the single PAN1326C2 Daughterboard (ENW89819AXKF), or the whole Evaluation Kit (ENW89819AYKF).
On request there is also the PAN1316C Daughterboard (ENW89819CXKF) available.

The Evaluation Kit for PAN1326C2 includes:

  • PAN1326C2 Daughterboard with TI CCEM Formfactor
  • EM Adapter Booster Pack (Adapter to connect Daughterboard with MPS432 Launchpad)
  • MSP432 Launchpad 


  • XDS110-ET open-source onboard debugger
  • UART-USB to PC Interface
  • 2 User LEDs
  • 2 User Buttons
  • Access to all GPIOs
P/N Package includes Stock Search
ENW89819AYKF 1x PAN1326C2 Evaluation Kit BUY
ENW89819AXKF 1x PAN1326C2 Daughterboard for use with TI MSP430 Launchpad BUY
ENW89819CYKF 1x PAN1316C Daughterboard for use with TI MSP430 Launchpad  


Get Started!

For starting developing your application please have a look at the Quick Start Guide.


Name File type Size Date Language
PDF WM PAN1326C2 Info Flyer 587KB 02.06.2020 English
PDF WM PAN1326C2 Product Specification Data sheet 2MB 15.12.2021 English
PDF WM PAN1316C Product Specification Data sheet 1MB 02.06.2022 English


Name File type Size Date Language
PDF WM PAN1326C2 Quick Start Guide Manual, QuickStart guide 2MB 30.03.2022 English
PDF WM PAN1326C2 Design Guide Manual, Design Guide 656KB 03.12.2020 English


Name File type Size Date Language
PDF Report of Confirmation of EU RoHS (Wireless Modules) Environmental, RoHS 733KB 18.08.2021 English
PDF Report of Confirmation of EU REACh (Wireless Modules) Environmental, REACh 733KB 18.08.2021 English


Name File type Size Date Language
PDF Modules for a wireless world Whitepaper 795KB 24.07.2020 English
PDF Moving forward with Bluetooth Low Energy Whitepaper 1MB 24.07.2020 English
PDF Wireless Connectivity Product Leaflet Flyer, Leaflet 2MB 29.07.2022 English
PDF EV Charging Solutions from Panasonic Industry Catalog, Brochure 2MB 07.03.2022 English
PDF Building Automation - Energy Management Solutions Catalog, Brochure 1MB 01.03.2022 English