PAN13x6C|2 (CC2564C)
Panasonic’s PAN13x6C|2 Series is a Host Controlled Interface (HCI) Bluetooth® Radio Frequency (RF) module that brings the CC2564C, Texas Instruments™ seventh generation Bluetooth core integrated circuit, to an easy to use module format. The PAN13x6C|2 is Bluetooth® 5.1 compliant and offers the best-in-class RF performance with about twice the range of other Bluetooth Low Energy solutions. The series comes in two versions: one with an integrated chip antenna (ENW89823A5KF) to keep the RF design effort to a minimum and one with an RF bottom pad (ENW89823C4KF) if radio hostile circumstances require an external antenna.
Technical Specification
Item |
Performance characteristics |
| Order number |
ENW89823A5KF (with Chip Antenna) ENW89823C4KF (RF Bottom Pad) |
| Production status | Massproduction |
| RF category | Bluetooth® 5.1 dual mode (BR, EDR, Bluetooth® LE) |
| Software/profile | HCI, Init Script by TI, Bluetooth Stack by TI |
| Used IC | CC2564C |
| Rx sensitivity | -90 dBm@1Mb/s |
| Tx power max |
+8 dBm (Chip Antenna) +11.5 dBm (RF Bottom Pad) |
| Antenna option | Ceramic Chip Antenna, External Antenna over RF Bottom Pad |
| Size (l x w x h) [mm] |
9.0 x 9.5 x 1.8 (ENW89823A5KF) 9.0 x 6.5 x 1.8 (ENW89823C4KF) |
| Power supply [V] | 1.7 to 4.8 |
| Power consumption Tx | 40 mA @8dBm (3.3V) |
| Power consumption Rx | 20 mA (3.3V) |
| Power consumption sleep | Deep Sleep Mode: 105 μA |
| Interfaces | GPIO, UART, PCM |
| Speciality | Small size, Bluetooth dual mode |
| Evaluation board/stick | ENW89819AYKF |
| Certification | EU CE RED / FCC / IC |
| Operating temperature | -40 to +85 °C |
| Standard packaging QTY | 1500 pcs |
EVALUATION KIT
It is possible to order the single PAN1326C2 Daughterboard (ENW89819AXKF), or the whole Evaluation Kit (ENW89819AYKF).
On request there is also the PAN1316C Daughterboard (ENW89819CXKF) available.
The Evaluation Kit for PAN1326C2 includes:
- PAN1326C2 Daughterboard with TI CCEM Formfactor
- EM Adapter Booster Pack (Adapter to connect Daughterboard with MPS432 Launchpad)
- MSP432 Launchpad
Features:
- XDS110-ET open-source onboard debugger
- UART-USB to PC Interface
- 2 User LEDs
- 2 User Buttons
- Access to all GPIOs
| P/N | Package includes | Stock Search |
|---|---|---|
| ENW89819AYKF | 1x PAN1326C2 Evaluation Kit | BUY |
| ENW89819AXKF | 1x PAN1326C2 Daughterboard for use with TI MSP430 Launchpad | BUY |
| ENW89819CYKF | 1x PAN1316C Daughterboard for use with TI MSP430 Launchpad |
Get Started!
For starting developing your application please have a look at the Quick Start Guide.
Datasheet
| Name | File type | Size | Date | Language |
|---|---|---|---|---|
| WM PAN1326C2 Info | Flyer | 587KB | 02.06.2020 | English |
| WM PAN1326C2 Product Specification | Data sheet | 2MB | 15.12.2021 | English |
| WM PAN1316C Product Specification | Data sheet | 1MB | 02.06.2022 | English |
Guides
| Name | File type | Size | Date | Language |
|---|---|---|---|---|
| WM PAN1326C2 Quick Start Guide | Manual, QuickStart guide | 2MB | 30.03.2022 | English |
| WM PAN1326C2 Design Guide | Manual, Design Guide | 656KB | 03.12.2020 | English |
Environmental
| Name | File type | Size | Date | Language |
|---|---|---|---|---|
| Report of Confirmation of EU RoHS (Wireless Modules) | Environmental, RoHS | 4MB | 21.09.2022 | English |
| Report of Confirmation of EU REACh (Wireless Modules) | Environmental, REACh | 4MB | 21.09.2022 | English |
Others
| Name | File type | Size | Date | Language |
|---|---|---|---|---|
| Modules for a wireless world | Whitepaper | 795KB | 24.07.2020 | English |
| Moving forward with Bluetooth Low Energy | Whitepaper | 1MB | 24.07.2020 | English |
| Wireless Connectivity Product Leaflet | Flyer, Leaflet | 2MB | 29.07.2022 | English |
| EV Charging Solutions from Panasonic Industry | Catalog, Brochure | 2MB | 07.03.2022 | English |
| Building Automation - Energy Management Solutions | Catalog, Brochure | 1MB | 01.03.2022 | English |
