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NPM-W2

The NPM-W2 combines accurate component placement, precise SPI and AOI inspection and reproductive adhesive dispensing in one high-speed solution.

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Higher productivity and quality thanks to the integration of printing, placement and inspection processes make the NPM-W2 to one of the most flexible and versatile pick and place solutions on the market.

This machine provides the user with a tool that allows him to choose between high speed or high accuracy, depending on the PCB requirements.

In addition, the NPM-W2 is optimized for larger boards and larger components, like PCBs up to 750 x 550 mm and components up to 150 x 25 x 30 mm (L,W,H). For high productivity dual lanes can be used.

Features

The multifunctional NPM-W2 is equipped with a 12-nozzle head and can place 38 500 components. 120 feeders can be mounted.

Additionally, the NPM-W2 can automatically inspect solder depots and components according to the production data.

As a third function the NPM has the conventional HDF discharge mechanism, which ensures the high-quality non-contact dispensing with a screw valve-dispenser.

Specifications

Model ID NPM-W2
PCB dimensions (mm) Single-lane*1 Batch mounting L 50 x W 50 ~ L 750 x W 550
2-positin mounting L 50 x W 50 ~ L 350 x W 550
Dual-lane*1 Dual transfer (Batch) L 50 × W 50 ~ L 750 × W 260
Dual transfer (2-positin) L 50 × W 50 ~ L 350 × W 260
Single transfer (Batch) L 50 × W 50 ~ L 750 × W 510
Single transfer (2-positin) L 50 × W 50 ~ L 350 × W 510
Electric source 3-phase AC 200, 220, 380, 400, 420, 480 V 2.8 kVA
Pneumatic source *2 0.5 MPa, 200 L /min (A.N.R.)
Dimensions *2 (mm) W 1 280*3 × D 2 332 *4 × H 1 444 *5
Mass 2 470 kg (Only for main body : This differs depending on the option configuration.)
Placement head Lightweight 16-nozzle head (Per head) 12-nozzle head (Per head) Lightweight 8-nozzle head (Per head) 3-nozzle head V2 (Per head)
High production mode [ON] High production mode [OFF] High production mode [ON] High production mode [OFF]
Max. speed 38 500cph (0.094 s/ chip) 35 000cph (0.103 s/ chip) 32 250cph (0.112 s/ chip) 31 250cph (0.115 s/ chip) 20 800cph (0.173 s/ chip)

8 320cph (0.433 s/ chip)

6 500cph (0.554 s/ QFP)

Placement accuracy (Cpk≥1) ±40 μm / chip ±30 μm / chip
(±25μm / chip)*6
±40 μm / chip ±30 μm / chip ± 30 µm/chip ± 30 µm/QFP
12mm
to 32mm
± 50 µm/QFP
12mm Under
± 30 µm/QFP
Component
dimensions (mm)
0402*7 chip ~ L 6 x W 6 x T 3 03015*7 *8/0402*7 chip ~ L 6 x W 6 x T 3 0402*7 chip ~ L 12 x W 12 x T 6.5 0402*7 chip ~ L 32 x W 32 x T 12 0603 chip to L 150 x W 25 (diagonal152) x T 30
Component supply Taping Tape : 4 / 8 / 12 / 16 / 24 / 32 / 44 / 56 mm Tape : 4 to 56 mm Tape : 4 to 56 / 72 / 88 / 104 mm
Max.120 (Tape: 4, 8 mm)

Front/rear feeder cart specifications : Max.120 (Tape width and feeder are subject to the conditions on the left)

Single tray specifications : Max.86 (Tape width and feeder are subject to the conditions on the left)

Twin tray specifications : Max.60 (Tape width and feeder are subject to the conditions on the left)

Stick - Front/rear feeder cart specifications :
Max.30 (Single stick feeder)
Single tray specifications :
Max.21 (Single stick feeder)
Twin tray specifications :
Max.15 (Single stick feeder)
Tray - Single tray specifications : Max.20
Twin tray specifications : Max.40
Dispensing head Dot dispensing Draw dispensing
Dispensing speed 0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ rotation) 4.25 s/component (Condition : 30 mm x 30 mm corner dispensing)*9
Adhesive position accuracy (Cpk≥1) ± 75 μ m /dot ± 100 μ m /component
Applicable components 1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP BGA, CSP
Inspection head 2D inspection head (A) 2D inspection head (B)
Resolution 18 µm 9 µm
View size (mm) 44.4 x 37.2 21.1 x 17.6
Inspection processing time Solder Inspection *10 0.35s/ View size
Component Inspection *10 0.5s/ View size
Inspection object Solder Inspection *10

Chip component : 100 μm × 150 μm or more (0603 or more)

Package component : φ150 μm or more

Chip component : 80 μm × 120 μm or more (0402 or more)

Package component : φ120 μm or more

Component Inspection *10 Square chip (0603 or more), SOP, QFP (a pitch of 0.4mm or more), CSP, BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*11 Square chip (0402 or more), SOP, QFP (a pitch of 0.3mm or more), CSP, BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*11
Inspection items Solder Inspection *10 Oozing, blur, misalignment, abnormal shape, bridging
Component Inspection *10 Missing, shift, flipping, polarity, foreign object inspection *12

Inspection position accuracy *13 (Cpk≥1)

± 20 μm ± 10 μm
No. of inspection Solder Inspection *10 Max. 30 000 pcs./machine (No. of components : Max. 10 000 pcs./machine)
Component Inspection *10 Max. 10 000 pcs./machine

Notes

  1. Please consult us separately should you connect it to NPM-D3/D2/D. It cannot be connected to NPM-TT and NPM.
  2. Only for main body
  3. 1 880 mm in width if extension conveyors (300 mm) are placed on both sides.
  4. Dimension D including tray feeder : 2 570 mm
    Dimension D including feeder cart : 2 465 mm
  5. Excluding the monitor, signal tower and ceiling fan cover.
  6. ±25 μm placement support option.(Under conditions specified by PSFS)
  7. The 03015/0402 chip requires a specific nozzle/feeder.
  8. Support for 03015 mm chip placement is optional. (Under conditions specified by PSFS:Placement accuracy ±30 μm / chip)
  9. A PCB height measurement time of 0.5s is included.
  10. One head cannot handle solder inspection and component inspection at the same time.
  11. Please refer to the specification booklet for details.
  12. Foreign object is available to chip components.(Excluding 03015 mm chip)
  13. This is the solder inspection position accuracy measured by our reference using our glass PCB for plane calibration. It may be affected by sudden change of ambient temperature.

*Placement tact time,inspection time and accuracy values may differ slightly depending on conditions
*Please refer to the specification booklet for details.

Downloads

Name Size Date
PDF NPM-W2 1.5 MB 07.08.2020