
About us
Higher productivity and quality thanks to the integration of printing, placement and inspection processes make the NPM-W2 to one of the most flexible and versatile pick and place solutions on the market.
This machine provides the user with a tool that allows him to choose between high speed or high accuracy, depending on the PCB requirements.
In addition, the NPM-W2 is optimized for larger boards and larger components, like PCBs up to 750 x 550 mm and components up to 150 x 25 x 30 mm (L,W,H). For high productivity dual lanes can be used.
The multifunctional NPM-W2 is equipped with a 12-nozzle head and can place 38 500 components. 120 feeders can be mounted.
Additionally, the NPM-W2 can automatically inspect solder depots and components according to the production data.
As a third function the NPM has the conventional HDF discharge mechanism, which ensures the high-quality non-contact dispensing with a screw valve-dispenser.
Model ID | NPM-W2 | ||
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PCB dimensions (mm) | Single-lane*1 | Batch mounting | L 50 x W 50 ~ L 750 x W 550 |
2-positin mounting | L 50 x W 50 ~ L 350 x W 550 | ||
Dual-lane*1 | Dual transfer (Batch) | L 50 × W 50 ~ L 750 × W 260 | |
Dual transfer (2-position) | L 50 × W 50 ~ L 350 × W 260 | ||
Single transfer (Batch) | L 50 × W 50 ~ L 750 × W 510 | ||
Single transfer (2-position) | L 50 × W 50 ~ L 350 × W 510 | ||
Electric source | 3-phase AC 200, 220, 380, 400, 420, 480 V 2.8 kVA | ||
Pneumatic source *2 | 0.5 MPa, 200 L /min (A.N.R.) | ||
Dimensions *2 (mm) | W 1 280*3 × D 2 332 *4 × H 1 444 *5 | ||
Mass | 2 470 kg (Only for main body : This differs depending on the option configuration.) |
Placement head | Lightweight 16-nozzle head (Per head) | 12-nozzle head (Per head) | Lightweight 8-nozzle head (Per head) | 3-nozzle head V2 (Per head) | |||
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High production mode [ON] | High production mode [OFF] | High production mode [ON] | High production mode [OFF] | ||||
Max. speed | 38 500cph (0.094 s/ chip) | 35 000cph (0.103 s/ chip) | 32 250cph (0.112 s/ chip) | 31 250cph (0.115 s/ chip) | 20 800cph (0.173 s/ chip) |
8 320cph (0.433 s/ chip) 6 500cph (0.554 s/ QFP) |
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Placement accuracy (Cpk≥1) | ±40 μm / chip | ±30 μm / chip (±25μm / chip)*6 |
±40 μm / chip | ±30 μm / chip |
± 30 µm/chip ± 30 µm/QFP
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± 30 µm/QFP | |
Component dimensions (mm) | 0402*7 chip ~ L 6 x W 6 x T 3 | 03015*7 *8/0402*7 chip ~ L 6 x W 6 x T 3 | 0402*7 chip ~ L 12 x W 12 x T 6.5 | 0402*7 chip ~ L 32 x W 32 x T 12 | 0603 chip to L 150 x W 25 (diagonal152) x T 30 | ||
Component supply | Taping | Tape : 4 / 8 / 12 / 16 / 24 / 32 / 44 / 56 mm | Tape : 4 to 56 mm | Tape : 4 to 56 / 72 / 88 / 104 mm | |||
Max.120 (Tape: 4, 8 mm) |
Front/rear feeder cart specifications : Max.120 (Tape width and feeder are subject to the conditions on the left) Single tray specifications : Max.86 (Tape width and feeder are subject to the conditions on the left) Twin tray specifications : Max.60 (Tape width and feeder are subject to the conditions on the left) |
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Stick | - | Front/rear feeder cart specifications : Max.30 (Single stick feeder) Single tray specifications : Max.21 (Single stick feeder) Twin tray specifications : Max.15 (Single stick feeder) | |||||
Tray | - | Single tray specifications : Max.20 Twin tray specifications : Max.40 |
Dispensing head | Dot dispensing | Draw dispensing |
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Dispensing speed | 0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ rotation) | 4.25 s/component (Condition : 30 mm x 30 mm corner dispensing)*9 |
Adhesive position accuracy (Cpk≥1) | ± 75 μ m /dot | ± 100 μ m /component |
Applicable components | 1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP | BGA, CSP |
Inspection head | 2D inspection head (A) | 2D inspection head (B) | ||
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Resolution | 18 µm | 9 µm | ||
View size (mm) | 44.4 x 37.2 | 21.1 x 17.6 | ||
Inspection processing time | Solder Inspection *10 | 0.35s/ View size | ||
Component Inspection *10 | 0.5s/ View size | |||
Inspection object | Solder Inspection *10 |
Chip component : 100 μm × 150 μm or more (0603 or more) Package component : φ150 μm or more |
Chip component : 80 μm × 120 μm or more (0402 or more) Package component : φ120 μm or more |
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Component Inspection *10 | Square chip (0603 or more), SOP, QFP (a pitch of 0.4mm or more), CSP, BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*11 | Square chip (0402 or more), SOP, QFP (a pitch of 0.3mm or more), CSP, BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*11 | ||
Inspection items | Solder Inspection *10 | Oozing, blur, misalignment, abnormal shape, bridging | ||
Component Inspection *10 | Missing, shift, flipping, polarity, foreign object inspection *12 | |||
Inspection position accuracy *13 (Cpk≥1) |
± 20 μm | ± 10 μm | ||
No. of inspection | Solder Inspection *10 | Max. 30 000 pcs./machine (No. of components : Max. 10 000 pcs./machine) | ||
Component Inspection *10 | Max. 10 000 pcs./machine |
*Placement tact time,inspection time and accuracy values may differ slightly depending on conditions
*Please refer to the specification booklet for details.
Name | File Type | Size | Date | Language |
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NPM-W2 | Catalogue | 1.5 MB | 07.12.2020 | English |