
About us
Building upon the PSX307 Plasma Cleaner, the PSX307A Plasma Cleaner features an enlarged plasma chamber capacity that improves productivity. In addition, the PSX307A system is able to handle full wafers (both bare and on dicing frames).
Besides the increased capacity, Panasonic's original Plasma Monitoring System suppresses abnormal discharges resulting in a secure and efficient production process.
Additionally, the option to include a traceability functionality ensures high level process Quality.
Surface cleaning and modification of wafers and substrates improves bondability and adhesivity in subsequent process steps.
The PSX307A Plasma Cleaner increases production capabilities by offering an enlarged chamber capacity, which enables more wafers and / or substrates to be processed.
The benefits of the Panasonic PSX307A are:
Model ID | PSX307A |
---|---|
Model No. | NM-EFP3A |
Cleaning Method | Parallel plate RF back-sputtering method |
Gas for Electrical Discharge*1 | Ar [Option:O2, O2 + He] |
Substrate dimensions | L 50mm × W 200mm*2 to L 350mm × W 350mm |
Substrate thickness | 0.1mm to 2.0mm |
Dimension/Mass*3 | W 900mm × D 1150mm × H 1650mm (Excluding touch panel, operating part, and signal tower / 630kg) |
Power source | 1-phase AC 200 / 208 / 220 / 230 / 240 ± 10V, 50 / 60Hz , 6.00kVA |
Adhesive dispenser | 0.49MPa、25 L/min [A.N.R] |
Notes
*Please refer to the specifications on Details.
Name | File Type | Size | Date | Language |
---|---|---|---|---|
MD-P300 Flip Chip Bonding | Whitepaper | 1.5 MB | 04.01.2021 | English |
PSX307A Product Brochure | Catalogue | 444.3 KB | 10.11.2020 | English |