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MD-P300 Flip Chip Bonder

High yield, high throughput ultrasonic flip-chip bonding.

factory_automation microelectronics MD-P300 Lsize_size shadow

The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.

The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head. 

The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.

The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.

Features and benefits of the Panasonic's MD-P300 Flip-chip Bonder

Easy process exchange

Bonding processes are available by switching the bonding tools, which can be performed by the customer by configuring the C4 dipping unit.

Real-time inspection

The bonding stage camera enables post-bonding inspection immediately after die bonding. This system enables manufacturing with real-time quality inspection.

User-friendly operation

A large touch panel and  interactive software realize an easy and reliable operating environment for all users from beginners to experts.

  • Process versatility
  • Ideal for processors, CMOS, MEMS and power devices
  • Fast and accurate

Specifications

Model ID MD-P300
Model No. NM-EFF1C
Productivity*1 C4: 0.65s/IC (including dipping motion)
Thermosonic: 0.65s/IC (including US process time of 0.2s)
Placement accuracy*1 XY (3 at PFSC conditions): ±5µm
Substrate dimensions (mm) L 50 × W 50 to L 330 × W 330 (Heating specifications: L 330 × W 220mm)
Die dimensions (mm) L 1 × W 1 to L 25 × W 25 (Thermosonic: L7 × W7)
Number of die types Up to 12 product types (AWC specifications)*1 nozzle type
Die supply Wafer frame 12 inches (Option: 8 inches)
Bonding load VCM head: 1N to 50N (Option: 2N to 100N)
Head heating Thermosonic: Up to 300°C
Substrate heating*2 Constant heating, Up to 200°C (Heating bonding stage specifications: Max. substrate size L 330 × W 220mm)
Power source*3 3-phase AC 200V ± 10V, 50/60Hz,
Up to 4kVA (Up to 7kVA for heating specification)
Pneumatic source 0.4Mpa, 50L/min (A.N.R.)
(Up to 150L/min for full-featured machine including cooling air)
Dimensions (mm) W 1380 × D 1640 × H 1430 (without loader / unloader)
Mass 2300kg (without loader / unloader)

*1: The described productivity and placement accuracy may differ depending on the conditions of use.
*2: Maximum setting temperature differ depending on the maximum substrate size. Please contact us individually.
*3: 3-phase 208 / 220 / 380 / 400 / 415 / 480
For details, please refer to the specification sheet. 

Downloads

Name Size Date
PDF IC Assembly System MD-P300 296.1 KB 22.06.2020