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MD-P300 Flip-chip Bonder

High yield, high throughput ultrasonic flip-chip bonding.

factory_automation microelectronics MD-P300 Lsize_size shadow

The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.

The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head. 

The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.

The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.

Features and benefits of the Panasonic's MD-P300 Flip-chip Bonder

Easy process exchange

Bonding processes are available by switching the bonding tools, which can be performed by the customer by configuring the C4 dipping unit.

Real-time inspection

The bonding stage camera enables post-bonding inspection immediately after die bonding. This system enables manufacturing with real-time quality inspection.

User-friendly operation

A large touch panel and interactive software realize an easy and reliable operating environment for all users from beginners to experts.

  • Process versatility
  • Ideal for processors, CMOS, MEMS and power devices
  • Fast and accurate

Specifications

Model ID MD-P300
Model No. NM-EFF1C
Productivity*1

C4: 0.65s/IC (including dipping motion)

Thermosonic: 0.65s/IC (including US process time of 0.2s)

Placement accuracy*1 XY (3σ at PFSC conditions): ±5µm
Substrate dimensions (mm) L 50 × W 50 to L 330 × W 330 (Heating specifications: L 330 × W 220mm)
Die dimensions (mm) L 1 × W 1 to L 25 × W 25 (Thermosonic: L7 × W7)
Number of die types Up to 12 product types (AWC specifications)*1 nozzle type
Die supply Wafer frame 12 inches (Option: 8 inches)
Bonding load VCM head: 1N to 50N (Option: 2N to 100N)
Head heating Thermosonic: Up to 300°C
Substrate heating*2 Constant heating, Up to 200°C (Heating bonding stage specifications: Max. substrate size L 330 × W 220mm)
Power source*3

3-phase AC 200V ± 10V, 50/60Hz,

Up to 4kVA (Up to 7kVA for heating specification)

Pneumatic source 0.4MPa, 50L/min (A.N.R.) (Up to 150L/min for full-featured machine including cooling air)
Dimensions (mm) W 1380 × D 1640 × H 1430 (without loader / unloader)
Mass 2300kg (without loader / unloader)

Notes

  1. The described productivity and placement accuracy may differ depending on the conditions of use.
  2. Maximum setting temperature differ depending on the maximum substrate size. Please contact us individually.
  3. 3-phase 208 / 220 / 380 / 400 / 415 / 480

For details, please refer to the specification sheet.

Downloads

Name File Type Size Date Language
PDF MD-P300 Flip Chip Bonding Whitepaper 1.5 MB 04.01.2021 English
PDF MD-P300 Product Brochure Catalogue 296.1 KB 10.11.2020 English