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MD-P200 Die Bonder

High accuracy, high quality, ultrasonic flip-chip device bonding.

factory_automation microelectronics MDP200 shadow

The MD-P200 Die Bonder offers the capability of multiple small die stacking which contributes to the downsizing of valuable devices. A variety of epoxy-supplying methods contributes to flexible production. Flip-chip and thermosonic bonding capabilities contribute to higher density and performance for valuable devices.

Features and benefits of Panasonic's MD-P200 Die Bonder

Unit Level Manufacturing by the synchro-motion of dispensing and bonding

The MD-P200's die bonding is carried out immediately after epoxy dispensing, thereby making it possible to finish the bonding operation before the epoxy has deteriorated. This realizes stable and high quality bonding at all bond positions on a substrate. In addition, the bonding stage camera enables pre-bonding inspection immediately after epoxy dispensing and post-bonding control immediately after the bonding of a die. This process enables manufacturing with real-time quality inspection.

User-friendly operation

A large touch panel and  interactive software realize an easy and reliable operating environment for all users from beginners to experts.

Specifications

Model ID MD-P200
Model No. NM-EFD1B
Productivity*1 0.56s/IC (Under the fastest conditions)
0.75s/IC for thermosonic bonding(Including process time of 0.2 seconds. Under the fastest conditions)
Placement accuracy*1 XY (3σ at PFSC conditions):
±7µm (Flip bonding), ±15µm (With pre-centering), ±25µm (Direct bonding)
Substrate dimensions (mm) L 50 x W 30 to L 280 x W 140 (For thermosonic: L 200mm x W 150mm)
Die dimensions (mm) L 0.25 x W 0.25 to L 6 x W 6
Number of Die types Up to 12 types (For AWC)/ Up to 10 types (Tray with the palette changer)/ Up to 5 types (Wafer frame with the palette changer)
Configuration of die feeder Wafer frame, Pre-expanded ring, Tray
Adhesive dispenser Air-powered writing, Stamping pin
Bonding load Pneumatic head: 0.5N to 10N (Option: 1N to 50N)
VCM head for thermosonic process: 1N to 50N (Option: 2N to 100N)
Head heating Constant heating, Up to 250°C for the pneumatic head, Up to 300°C for the VCM head
Substrate heating Constant heating, Up to 300°C
Number of nozzles Up to 24 nozzles (Pickup nozzle, Bonding nozzle, Stamping tool)
(Not available for the thermosonic nozzle)
Power source*2 3-phase AC 200V ±10V, 50 / 60Hz, Up to 4kVA (Up to 7kVA for heating specification)
Pneumatic source 0.5MPa, 30L/min (A.N.R.) (Up to 150L/min for full-featured machine including cooling air)
Dimensions (mm) Standard specification (Up to 200mm substrate length. including loader/unloader)
W 1950mm x D 1190mm x H 1720mm (Machine body: W 1190 mm x D 1190mm x H 1720mm)
Mass 2200kg (including loader / unloader)

*1:The described productivity and placement accuracy may differ depending on the conditions of use.
*2:Three phase 208 / 220 / 380 / 400 / 415 / 480
For more details, please refer to the specification sheet. 

Downloads

Name Size Date
PDF IC Assembly System MD-P200 308.3 KB 22.06.2020