APX300 Plasma Dicer
Plasma dicing is becoming increasingly attractive in the semiconductor market. Dies are becoming smaller and thinner and manufacturers are facing difficulties such as increasing material loss due to the width of the dicing line, mechanical damage to the dies from chipping and increasingly longer processing times due to line-by-line mechanical dicing.
Panasonic’s APX300 Plasma Dicer solves these challenges and simultaneously provides a higher quality product with a lower cost of production.
Features and benefits of Panasonic's APX300 Plasma Dicer
Plasma dicing requires a dicing street mask. After the mask is applied to the surface of the wafer and the dicing streets are exposed, the plasma process etches the exposed streets by a chemical reaction.
By using a chemical etching process, a chipping-free and particle-free process is achieved. Thanks to the use of mask patterning, narrower street widths are possible – allowing more chips to be designed onto the wafer. Furthermore, the mask patterning allows complete flexibility in chip size, shape and position.
The benefits of the Panasonic APX300 Plasma Dicer are:
- Particle-free and damage-free process
- Higher chip strength
- Yield improvements
The Panasonic APX300 is available in a stand-alone single chamber (1 chamber) or a multi chamber (1, 2, or 3 chambers) configuration.
Panasonic can provide a plasma dicing total solution to achieve a damage-free, particle-free, higher throughput and lower overall cost of production.
The Panasonic APX300 is CE certified.
|Plasma Source||ICP plasma|
|Process Gas||4 Lines (standard)
(Maximum 6 Lines: Chlorinated Gas, Fluoride Gas, Ar, O2, He, etc.)
|Wafer size*1||Ø100 mm wafer with orientation flat (standard)|
|Dimensions (mm)||W 1350 x D 2230 x H 2000
(Does not include touch panels, operation section and signal tower)
|Weight||2100kg (differs depending on machine configuration)|
|Power Source*2||3-phase AC 200 / 208 / 220 / 230 / 240 ±10V, 50 / 60Hz, 21.00kVA|
|Pneumatic Source||0.5MPa to 0.7MPa, 250L/min (A.N.R.)|
0.1MPa to 0.2MPa, 50L/min (A.N.R.)
*1: For other size wafers, please contact us
*2: 2 line 3-phase power source, and this shows the total
|Plasma Dicing - Technology and total process||3.5 MB||22.06.2020|
|Plasma Processing Equipment Multiple Chamber System APX300 (Option PM)||310.4 KB||22.06.2020|
|Plasma Processing Equipment Plasma Dices APX300 (Dicer Module)||411.2 KB||22.06.2020|