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Microelectronics Solutions

Delivering the latest systems for: plasma dicing and dry etching of wafers; plasma cleaning of wafers and substrates; and high quality ultrasonic flip-chip bonding of bare ICs.

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High quality & high precision equipment

With decades of experience - including as a manufacturer ourselves - we are continually improving our technologies and developing new solutions.

We provide a line-up of cutting-edge microelectronics equipment to help our customers reduce production costs and increase quality.

Other available product lines

MD-P300 Flip-chip Bonder

High yield, high throughput ultrasonic flip-chip bonding.

MD-P200 Die Bonder

High accuracy, high quality, ultrasonic flip-chip device bonding.

PSX307A Plasma Cleaner

Wafer level parallel plate plasma cleaning technology.